Freecolor's FC-UV4060H is our new multifunctional printer ! designed for special materials height requirement , the print size up to 45x65cm max. and print height up to 40cm max. This new technology c…
Freecolor's FC-UV4060 MAX PLUS is our new multifunctional printer ! with double printhead, adopt double CMYK and 4xWhite color model, which greatly increase the print speed to meet your large jobs req…
Shanghai Zhenshi Industry Co.,Ltd is UV printer manufacturersFreecolor's FC-UV4060 MAX is our hot sale multifunctional printer ! the print size up to 45x65cm max. This new technology combine UV curabl…
Freecolor Direct to Substrate Printer Freecolor's FC-UV4060 is our hot sale multifunctional printer ! This new technology combine UV curable inks and a built-in UV-LED lamp to produce vibran…
Freecolor's FC-UV2030 is our latest mini size multifunctional uv printer ! This new technology combine UV curable inks and a built-in UV-LED lamp to produce vibrant full color and textured i…
Heat Dissipation Structure Ceramic SubstratesAdvantages:1. Refractory.2. Self Lubricating.3. Long Service Life.4. Good Polished Surface.5. Environmental and Healthy.6. Superior Mechanical Strength.7. …
4inch dia100m 4H-N type Production grade DUMMY grade SiC substrates,Silicon Carbide substrates for semiconductor device,
Application areas
1 high frequency and high power electronic devices …
sapphire optical lens, Al2O3 single crystal glass window, double side polished sapphire plates by random orientation,A-plane,M-plane,R-plane sapphire glass plates
Why choose the sapphire?
Sa…
Material:Sapphire
Thickness: 0.1~2mm
Min feature size: 0.01mm
Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in CAD
Tolerance: 5~20um depends on…
Ceramic Radiating Cooper Sputtering System / Ceramic Chips Directly Plating Copper Sputtering Equipment
Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate
The DPC…
Product features:The ceramic circuit board has high accuracy and good electrical and thermal properties2. ceramic circuit board with high bonding strength and good weldability, can realize blind throu…
Electronic packaging requires the substrate material to meet the high thermal conductivity, low dielectric constant, and the chip with the thermal expansion coefficient, good processing performance,…
Telephone: 027-8811-1056WeChat:yjqp3344Mail: market@folysky.comSkype:Pengliang TuFolysky Technology(Wuhan)Co.,Ltd, is a professional engaged in the plane and three-dimensional inorganic non metal base…
ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea