Quick Detail
Place of Origin
Brand Name
ROYAL
Model Number
RTAC1215-SP
HS-CODE
85-
Package & Delivery Lead Time
Package
Export standard, to be packed in new cases/cartons
Delivery Lead Time
12 weeks
Detailed Description
Ceramic Radiating Cooper Sputtering System / Ceramic Chips Directly Plating Copper Sputtering Equipment
Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate
The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application isCeramic Radiating Substrate.
Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods:DBC LTCC HTCC, much lower production cost is its high feature.
Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.
The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board.
Copper Sputtering Coating Machine Key Features
1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit.
2. Multilayer and co-deposition coating available
3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.
4. Ceramic/ Al2O3/AlN substrates heating up unit;
5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating.
Copper Sputtering Coating Machine Specifications
Performance
1. Ultimate Vacuum Pressure: better than 5.010-6 Torr.
2. Operating Vacuum Pressure: 1.010-4 Torr.
3. Pumpingdown Time: from 1 atm to 1.010-4 Torr 3 minutes ( room temperature, dry, clean and empty chamber)
4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.
5. Operating Model: Full Automatically /Semi-Auto/ Manually
Structure
The vacuum coating machine contains key completed system listed below:
1. Vacuum Chamber
2. Rouhging Vacuum Pumping System (Backing Pump Package)
3. High Vacuum Pumping System ( Magnetically Suspension MolecularPump)
4. Electrical Control and Operation System
5. Auxiliarry Facility System (Sub System)
6. Deposition System
Al2O3, AlN substrates with Copper Plating Samples
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
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