Free training WDS-660 auto xiaomi motherboard bga reballing kit with infrared

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Product
Free training WDS-660 auto xiaomi motherboard bga reballing kit with i...
Posting date : Jul 13, 2016
Membership
Free Member Scince Jul 06, 2016
FOB Price
EXW 7800$
Min. Order Quantity
1 pcs
Supply Abillity
300 pcs/month
Port
Shenzhen,Hongkong
Payment Terms
T/T,PayPal,MoneyGram,Western Union,Escrow,credit card,cash
Package
Fumigation certified wood packing
Keyword :
Category
Contact
Zhang
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Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
WDS
Model Number
WDS-660 BGA rework
HS-CODE
-
Package & Delivery Lead Time
Package
Fumigation certified wood packing
Delivery Lead Time
2 days after full payment
Detailed Description

Total Power

Max 6600W

Upper Heating Power

1200W

Lower Heating Power

Second zone: 1200W, Third zone: IR 4200W

Power Supply

(Single Phase)AC 220V±10V 50Hz±3Hz 5.4 KVA

Machine Dimension

L1200*W800*H900mm

Positioning Way

V-shape card slot, PCB holder can be adjustable by X and Y axes 

Temperature Controlling 

K-type thermocouple closed loop control, independent temperature control

PCB Size(Max)

500*500mm

PCB Size (Min)

10*10mm

PCB Blowup Diploid

2-50X

Weight of machine

110Kg

Thermocouple Ports

3units

Free training WDS-660 auto xiaomi motherboard bga reballing kit with infrared

1. Touch screen interface and PLC controlling. display 3 temperature curves in any time. The temperature is controlled accurately between -1 degree and 1 degree.    laser bga reballing machine
2. 6 segments controlling temperature, which could be controlled pre-heating, stillstand, heating, soldering 1, soldering 2 and cooling. The first-rate temperature controlling effectively ensure soldering effect.
3. WDS-660 could save 1-100 phases temperature curves. You could analyze curve and change setting at touch screen.
4. There are 3 independent heating zones. The first and second heating zone could control the temperature in numerous phrases and the third heating zone pre-heating whole PCB so that achieve the best soldering effect. The temperature,time,slope,alarm are all displayed in the touch screen.
5. Accurately inspect temperature by high accurate K-type thermocouple with closed loop control. External temperature measurement interface detect temperature accurately.
6. Alarming after BGA was soldering and unsoldering. Circuit was interrupted automatically when the temperature is out of control which is double overtemperature protection function. 
7. WDS-660 adopt high power cross-flow wind to cool the PCB board quickly, preventing the PCB board from deformation to ensure soldering effect.     laser bga reballing machine  
 
8. PCB board was located in "V" slot. The flexible and convenient universal fixture protect the PCB board.
9. Touch screen control upside heating system and Optical alignment device system. Operation is convenient and flexible so that ensure alignment error within 0.01-0.02mm.
10.Hot air head and mounting head 2 in 1 design, stepping motor drivers,auto-solder and unsolder function. Equipped with various BGA sizes muzzles so that easy to replace. And the same time special requirements can be customized.
11. High precision optical vision system with optical image, fine adjustment and 15 inch color LCD monitor.
12. High automatic avoid manual mistake. Reworking lead free and double BGA board will be accurate.     laser bga reballing machine 

Pls Contact me as below guide, we are glad to give you the best price!

Contact: Shirley

Tel: 0086 0755 27336219

Skype: salesool-wisdomshow

What's app: +86 15573072473

https://www.youtube.com/watch?v=AaMPtYaAm_U

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