FLYING FO-SA Sublimation Offset Ink was designed for offset printing . It was used on all kinds offset printing machine such …
Key Features:
All metal construction, fully sealed design.Single-axis friction position, the median with zero self-lockingOutput forms: Potentiometer, Hall voltage and Standard voltage outputLong…
Introduction
Two part thermal sealing compound-- ceramic-filled silicone gels with high thermal conductivity. After mixing, reaction will take place at room temperature or speed up the reaction b…
Introduction
EMI absorption Thermal PCM--Three functions combined: Thermal conductivity, Electromagnetic absorber and Phase change, it helps to solve the issues at the same time. It is a effectiv…
Introduction
EMI shielding thermal pad--Both issues of thermal conductivity and Electromagnetic absorber can be solved at the same time in the limited space and time. Also simplify the mechanical…
Introduction
Thermally conductive insulator--this product replaces the traditional thermal putty which coated with an insulating sheet, thermal polyimide reinforcement and silicone coating make i…
Introduction
Thermal fiberglass is composite of high performance ceramic filler and 30um thin fiberglass. Achieving high thermal conductivity on flatness surface with low pressure. Recommended us…
Introduction:
XK-FN Non-silicone thermally conductive fiberglass for silicone-sensitive applications. (EX: LED , Telecom and Aerospace ). XK-FN: ceramic filled and polyester resins coated either …
Introduction
Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK-F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving h…
Introduction
Silicone rubber base with high heat-conducting filling materials. The coefficient of heat conductivity can reach 1.0~ 3.0 W/m.K. This kind of materials offers super heat-conducting p…
Introduction
Thermal silicone gap pads are resilient, suitable for large institutional design tolerances. Product is Double-layer structure, reinforcing with special ultra-thi…
ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea