Horizontal Thermal Test Chamber

China [CN]

Application 
JOEO horizontal thermal test chamber is the best choice for batch testing and large test loads. The interior design is used for custom environmental stress screening of components and board level electronic components. The carrier basket transfers loads between hot and cold zones in two - or three-zone configurations, and is widely used in automotive, electronic and electrical, aerospace, communication equipment, medical equipment and other industries. 

Description
JOEO Horizontal thermal test chamber are available in a variety of configurations and are the right solution for all thermal shock test requirements for large or batch products.If you need more models about our test equipment, please reference our chamber-testing（.）com 
Two zones, single capacity (-2)
(One hot zone and one cold zone)
The product in the test moves through a carrying basket, alternating between hot and cold zones.

Two-zone Dual Capacity (-2D)
(Two hot zones and one cold zone)
In a two-zone, two-capacity system, the cold zone is always in use, which helps to improve system efficiency.
Three zones, single capacity (-3)
(One hot zone, one normal zone and one cold zone)
In the horizontal three zones, the product moves through the carrier basket between the cold zone and the normal temperature zone, and the hot zone moves to surround the product basket.

Feature

• The reference test load of the JOEO thermal test chamber is composed of 12 steel plates. Each pound of steel has an exposed surface area of 65 square inches. The test load is oriented in the product carrier, with the airflow parallel to the steel plate. The load is distributed between two product carriers.
• The weight of any additional racks must be included in the test load shown above.
• The capacity depends on the stability of the product at extreme temperatures before transfer. Do not use environment dwell time.
• When assisted by liquid nitrogen, smaller mechanical refrigeration systems will maintain low temperatures. Liquid nitrogen is required to meet the recovery time.
• For a liquid nitrogen only thermal chambers, the maximum load is liquid nitrogen cooling without mechanical cooling.
• Use IC chip product loading to recover 9 point products in 15 minutes or less. The load is distributed between two product carriers.