Items
|
Performance Index (Measured value)
|
Peeling strength (n/mm)
|
1.8
|
Insulation resistance (ω)
|
>1*10 g
|
Breakdown voltage (vdc)
|
>2 k
|
Soakable soldering (°C/m)
|
280°C / 260°C, 1 min, no bubble & delamination
|
Thermal conductivity (ω/m-k)
|
>0.8
|
Thermal resistance (°C/ω)
|
< 1.2
|
Combustibility
|
fv-o
|
Dielectric constant (1mhz)
|
4
|
Dielectric loss angle (tangent)
|
0.03
|
Feature
|
Capability
|
Quality Grade
|
Standard IPC 2
|
Number of Layers
|
4 – 24 Layers
|
Order Quantity
|
1pc - 10000+pcs
|
Build Time
|
2 Days – 5 Weeks
|
Material
|
Aluminum core (Domestic 1060), Copper core, FR4 covering
|
Board Size
|
Min 6*6mm | Max 610*610mm
|
Board Thickness
|
0.8mm - 5.0mm
|
Copper Weight (Finished)
|
0.5oz - 10.0oz
|
Min Tracing/Spacing
|
4mil/4mil
|
Solder Mask Sides
|
As per the Gerbers
|
Solder Mask Color
|
Green, White, Blue, Black, Red, Yellow & Super-White
|
Silkscreen Sides
|
As per the file
|
Silkscreen Color
|
White, Black, Yellow
|
Surface Finish
|
HASL - Hot Air Solder Leveling Lead Free HASL - RoHS ENIG - Electroless Nickle/Immersion Gold - RoHS
|
Min Annular Ring
|
4mil
|
Min Drilling Hole Diameter
|
6mil
|
Other Techniques
|
Countersink holesScrew holes
|