Heat Shrink F Terminal

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Heat Shrink F Terminal
Posting date : May 28, 2014
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Free Member Scince May 15, 2014
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HS-CODE
85-
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Detailed Description
Applications HSFT made by polyolefin, with adhesive lining for protecting splices from water and corrosion. Providing strain relief and against vibration in rugged environment, which completely insulates and protects terminations and other electrical components. In the end of the splice is high pure copper sheet, with excellent conductivity property. HSMT and HSFT offers long-term performance, easy installation, and a low installed cost, which is more reliable than conventional crimp terminals. Characteristics Shrink ratio 3:1 Hot-melt adhesive provides excellent waterproof property Excellent stretch and mechanical damage resistance. High tensile strength Good conductivity property High elasticity keeps steady performance Operating Temperature Range Operating temperature: -55˚C~125˚C Minimum shrink temperature: 80˚C Minimum fully recovery temperature: 130˚C

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