Plate Type Silicon Wafer Cleaning Machine

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Plate Type Silicon Wafer Cleaning Machine
Posting date : Apr 15, 2014
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HS-CODE
85-
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Detailed Description
the cleaning object is 2 to 8 inches of grinding silicon wafer. The whole equipment controlled by imported PLC. Through setting the work rhythm, transmission rack after each process, starting from material to material are done automatically. Equipment work rhythm, the parameters set by the touch screen to complete. The whole equipment is sealed structure, with air exhaust device. Unique manipulator design to capture more accurate .Humanization design, can be customized according to user requirements

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
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