Semiconductor Etching Equipments

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Semiconductor Etching Equipments
Posting date : Apr 15, 2014
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85-
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Semiconductor etching machine (semi automatic) (non-standard equipment) General description:suitable for etching of 2 "- 8" wafer.Conversion between corrosion grooves and cleaning groove is driven by imported SEW 1.Object: wafer cleaning 2 (1)the ultrasonic cleaning, heating cleaning for single slottiming control, to give the end tone. (2)The process: material,supported ionic water ultrasonic cleaning, deionized waterheating and cleaning, deionized water washing, cutting 3 Features: this equipment is cabinet type, the operating side has a transparent window. 4 Channel material is German imports of polypropylene(PP magnetic white board), welded with SS outsourcing 5mm thick German magnetic white board PP, beautiful in appearance. 5 Ultrasonic cleaning equipment, heating time by the timercontrol. 6 Heating tank is provided with a temperature control table(pompon) and sensor. 7 Each cleaning tank is independent. water supply for ultrasonic cleaning tank (Flushing cleaning tankequipped with hot water), drainage is manual . 8 Equipped with adjustable exhaust device type. 9 Equipped with USA imported nitrogen gun. 10 The electric control part adopts a sealing protection way with the emergency shutdown and alarm device.

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