printed circuit baord

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printed circuit baord
Posting date : Mar 28, 2014
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85-
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Article Description Capability Size Max.Finshed Size 20.9”x24.4”(530mm x 620mm ) Board Thickness Standard 0.004”to0.16 ” ±10% ( 0.1mmto4.0mm±10% ) Min. Single/ Double-sided:0.008”±0.004”(0.2mm ±0.1mm) 4-layer:0.01”±0.008”(0.4mm ±0.1mm) 8-layer :0.01”±0.008”(0.4mm ±0.1mm) Bow and twist < 7/1000 Copper Weight Outer Cu weight 0.5oz ~ 3.0oz Inner Cu wight 0.5oz ~ 3.0oz Laminate Materials FR-4,FR-1,CEM1,CEM3 Board Cutting Max. number of layers 1 Min. thickness for inner layers (Cu thickness are excluded) 0.003”(0.07mm) Drilling Min. Size 0.0078”(0.2mm) Max. Size 0.3”(8.0mm) Drill Deviation ± 0.002” (0.050mm) PTH hole tolerance ± 0.002” (0.050mm) NPTH hole tolerance ± 0.002” (0.050mm) Plating Min. hole size 0.0008” (0.02mm) Aspect ratio 20(5:1) Solder Mask Color green,light green,white,black,dark brown,yellow,red,blue Min. solder mask clearance 0.003”(0.07mm) Thickness 0.0005”-0.0007”(0.012mm-0.017mm) Silkscreen Color White,black,yellow,red,blue,green Min. Size 0.006” (0.15mm) Electrical testing Flying Probe Tester Y Controlled Impedance Tolerance ±0.5% Impedance tester Tektronix TDS8200 Routing End Mills Test ± 0.006”(0.15mm) CNC Tolerance ± 0.004”(0.1mm) V-Cut Depth( residual thickness ) 1/2+-0.1mm V-cut angle 15°,18°,30° V-cut Shape line,hole,V-shape Surface Finish HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon… Gold Finger angle 15° 30° 45° 60° Others UL Cert. Y ISO Cert. ISO9001 TS16949 Y ISO14000 Y

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