Heat-Shrink Solderable Butts

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Heat-Shrink Solderable Butts
Posting date : Sep 30, 2013
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Free Member Scince Sep 30, 2013
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MACHINERY & ELECTRICAL | Electrical
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HS-CODE
85-
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SPECIFICATIONS 1. MATERIAL: (INSULATION) HEAT-SHRINKABLE POLYOLEFIN, (SOLDER) LEAD-FREE TIN, (RINGS) MELTABLE THERMALLY STABILIZED THERMOPLASTIC. 2. SOLDER MELTING TEMP: 138℃, FLUX ACTIVATED ROSIN 3. WORK TEMP: -55℃ to +125℃ 4. SHRINKING TEMP: >200℃ 5. DIELECTRIC STRENGTH: 2kV 6. PROTECTION TYPE: IP 67
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