Flexible PCB board with FR4 Stiffer

Quick Detail

Package & Delivery Lead Time

Detailed Description

Flexible PCB Board with FR4 Stiffer ------------------------------------------------------------------- Our Production Capability for PCB Layer: 1 to 28 layers Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers Board thickness: 0.21mm to 7.0mm Copper thickness: 0.5 OZ to 7.0 OZ Copper thickness in hole: >25.0 um (>1mil) - Max. Board Size: 23 × 25 (580mm×900mm) - Min. Drilled Hole Size: 3mil (0.075mm) - Min. Line Width: 3mil (0.075mm) - Min. Line Spacing: 3mil (0.075mm) Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating Solder Mask Color: Green/Yellow/Black/White/Red/Blue - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 PCB Packing - Inner packing: Vacuum packing / Plastic bag - Outer packing: Standard carton packing Certificate: UL, ISO 9001, ISO 14001 Special requirements: Buried and blind vias+controlled impedance +BGA Profiling: Punching, Routing, V-CUT, Beveling Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. Contact us to check out great PCBs and full details, we will reply to you with prices in one working day! OEM services provided Certificate: UL, ROHS, ISO9001 Factory Directly Quotation requirement *Gerber file and BOM *Clear photos of pcba or pcba sample deliver to us *PCB & PCBA function test method Orientronic PCB Production Flow: Data Processing →MI Examination →KaiLiu→ Grileed Plate → Inner Line → Inner Line Sezure → Layer etching → the inner layer of corrosion found → lamination → Bored → Desmear → IQC → PTH → Plate the entire board → Line Printing → Graphics transfer → line seizure →pattern plating →Tin. Nickel, Gold →Membrane back→ Etching→ Corrosion Found→Solder → Exposure → Test → Characters → Surface Treatment → IQC → Moulding → Electrical Measurement → FQC → PCBA Orientronic SMT Production Flow: Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock →DIP → Wave Soldering → Touch Up → 100% Visual Inspection →In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

Basic Company Information

ShenZhen WenDeFeng Technology Co., Ltd

Company Advantage

Detail Company Introduction