HDI PCB High Density Interconnection PCB Board

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HDI PCB High Density Interconnection PCB Board
Posting date : Jun 18, 2012
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Free Member Scince Jun 18, 2012
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HS-CODE
85-
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Detailed Description
Our factory capability and technology 1. Material: FR4 (Normal and High TG)/CEM-3/PTHE Aluminum-Base/Rogers /Halogen Free/Rogers/Ferrum and the like 2. Layer Counts: 1 to 30 layers are available; 3. Finished Borad Thickness: 3.1 Finished Board Thickness: Two-layer P.C.B.: 0.2mm~3.2mm; Multi-layer P.C.B.: 0.6mm~7.0mm; 3.2 Board Thickness Tol: more or less than 10%; 4. Finished Copper Thickness Inner: 17um~190um; Outer: 35um~190um; 5. Drilling/Holes 5.1 Hole Position Tol: more or less than 0.075mm; 5.2 Hole Size Tol : PTH: more or less than 0.075mm;NPTH: more or less than 0.05mm; 6. Plating 6.1 Copper PTH: 18-40um; 6.2 HASL(LF):2.5um; ENIG-NI:3-7um; Au: 1-5u''; OSP: 0.2-0.5um; 7. S/M and Silkscreen Ink: 7.1 S/M Color: Green/Matte Green, Black/Matt Black, Red, Yellow, Blue, (S/S; D/S) 7.2 Min S/M Dam: 0.1mm 7.3 Min S/M Clearance: 0.05mm; 7.4 Silkscreen/Legend Color: Normal: white;(S/S; D/S) 8. Surface Treatment: 8.1 HASL(Lead Free), Immersion Silver, Immersion Tin, Gold Finger, Flash Gold Plating, OSP, 8.2 ENIG(Immersion Gold): Au Thickness: 0.0762um~0.762um; Ni Thickness: 0.0254um~0.127um; 9. Outline/Profiling Panel Outline Tol:+/-0.13mm; Bevelling: 30angle, 45 angle; Gold Finger Angle: 15 angle 30 angle 45 angle 60 angle 10. Certificate: ROHS, ISO9001:2008, SGS, UL certificate. 11. Speciality: Spacial Process: Blind/Buried Via, HDI Microvia, Rigid Flex. Special Offer: Quick-turnaround PCB.

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
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