HDI PCB High Density Interconnection PCB Board

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Specifications HDI pcb Material :FR-4, 2OZ, 2.0mm Min hole :0.2mm Min line width/space: 0.25mm/0.25mm HDI pcb Material :FR-4, 2OZ, 2.0mm Min hole :0.2mm Min line width/space: 0.25mm/0.25mm Surface finish: HASL Lead Free Reference - Our Production Capability for Rigid PCB: 1) Layer: 1-30 2) Board finished thickness: 0.21mm-7.0mm 3) Material: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers 4) Max. finished board size: 23 × 25 ( 580mm×900mm ) 5) Min. drilled hole size: 3mil (0.075mm) 6) Min. Line width: 3mil (0.075mm) Min.Line spacing:3mil (0.075mm) 7) Surface finish/treatment : HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating -Other Technology: Gold Finger,Peelable Mask,Non-across Blind/ Buried Vias;Characteristic impedance Control,etc 8) Copper thickness: 0.5-7.0 OZ 9) Solder mask color: green/yellow/black/white/red/blue 10) Copper thickness in hole: >25.0 um (>1mil) 11)Inner packing: Vacuum packing / Plastic bag Outer packing: Standard carton packing 12) Shape tolerance: ±0.13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05 13) Certificate: UL, ISO 9001, ISO 14001, 14) Special requirements: Buried and blind vias+controlled impedance +BGA 15) Profiling: Punching, Routing, V-CUT, Beveling 16) Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products

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Akeson Circuit Co.,Ltd.

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