Mobile Phone PCB

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Mobile Phone PCB
Posting date : Jan 05, 2012
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HS-CODE
85-
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Detailed Description
1. Layer: 1-22 2. Board finished thickness: 0.2mm-7.0mm 3. Meterial: FR4, CEM-3, High TG, FR4 Halogen Free, Rogers 4. Max. Finished board size: 580*900m 5. Min hole size: 4mil(0.1mm) 6. Min trace width/space: 3.5mil 7. Surface finishing/treatment: HASL/Lead free HASL, Imemersion sliver, immersion Tin, OSP 8. Copper thickness: 0.5oz to 6oz 9. Solder mask color: Green/yellow/black/red/blue 10. Copper thickness in hole: >18um 11. Outline tolerance: +/-0.13mm Hole size tolerance: PTH+/-0.076mm NPTH+/-0.05mm 12. Quality ensure: UL approval TS16949: 2002 13. Buried and Blind vias, impedance control, via plug, BGA soldering, Gold finger

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