4-layer MP3 PCB

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4-layer MP3 PCB
Posting date : Dec 12, 2011
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Free Member Scince Oct 21, 2011
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HS-CODE
85-
Package & Delivery Lead Time
Detailed Description
Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK HDI Item Mass Production Prototype HDI structure 1+N+1,1+1+N+1+1 2+N+2 Buried hole Filled Filled Aspect ratio 0.75:1 0.75:1 Minimum laser hole 0.1mm(4mil) 0.1mm(4mil) Minimum laser pad 0.25mm(10mil) 0.25mm(10mil) Blind hole No filled No filled Rigid & Flex board NO YES Press fit hole YES YES Control Depth drilling YES YES Lead-free &Halogen-free YES YES Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm Immersion Tin 0.6-1.2µm 0.6-1.2µm Immersion silver 0.2-0.6µm 0.3-0.6µm OSP 0.1-0.4µm 0.25-0.4µm HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm

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