Multi Wafer

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Multi Wafer
Posting date : Sep 13, 2011
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Free Member Scince Aug 31, 2011
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HS-CODE
85-
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Detailed Description
6” Multi Wafer Specification Edge Defect Length≤5mm, depth≤0.5mm (Max 1 pcs/w) Saw mark ≤30μm (depth) Crack and pin holes No cracks and pin holes Micro-crack,pitting holes and inclusions No non-penetrating & penetrating micro crack, inclusions and holes Surface cleanliness As cut and cleaned , No stains , scratch, contamination , watermark and fingerprints Angle between square sides 90±0.3 deg. Bevel edge width (hypotenuse) 0.5~2 mm Bevel edge angle 45±10 deg. Length of wafer edge 156±0.5mm Thickness 200 ± 20μm TTV ≤50μm Bow ≤70μm Warp / Warpage <70μm Dopant P型 Resistivity 0.5 ~ 3.0Ω/cm Lifetime 2.0μm(Brick level) We can supply 156 * 156 ,Multi Wafer , produced in Taiwan,1.75 USD/piece. If need to the detailed specification please inform E-mail or fax.

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
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