DR-BDT50C Semiconductor-pumped Laser Marking Machine

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DR-BDT50C Semiconductor-pumped Laser Marking Machine
Posting date : Jul 07, 2011
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84-
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Description: The device uses semiconductor-pumped solid-state laser, it uses semiconductor laser diode-pumped Nd: YAG medium of 808nm wavelength, and the medium produced a large number of inverted particles which formed giant pulsed laser output of 1064nm wavelength under the action of Q switching, so the electro-optical conversion is efficient. The product size is small, which is only one-fourth of the traditional lamp-pump; the professional designed laser resonator make beam quality better, and processing lines more elaborate; the accompanied precision XYZ three-dimensional table can achieve precision positioning requirements; the equipped high precision water temperature control system provides reliable long-life protection for the machine. The software control system adopts WINDOWS XP as the operating platform, all-Chinese language interface, compatible with AUTOCAD, CORELDRAW, PHOTPSHOP and other file output. It supports marking of bar code, text, graphics etc. the PLT, DXF, BMP and other file formats, direct using SHX, TTF font store. The system can automatically encode, print serial number, batch number, and dates and so on. Galvanometer scanning system: Imported scanner contributes to high-precision and fast scanning, and stable performance. Q-switch system: Imported acousto-optic Q-system has the advantage of little optical loss, ensuring that the laser system can work a long time with stability. The 1 ~ 20KHZ frequency adjustment range make the system suitable for different materials, and satisfying different marking effect requirements. Application materials, industrial applications: It can mark on metal and a variety of non-metallic materials, especially suitable for some occasions of detailed requirements and high precision. It is used in electronic components, hardware tools, accessories, integrated circuit (IC), electrical appliances, mobile communications, precision instruments, spectacles and clocks, jewelry, auto parts, plastic buttons, construction material, PVC pipe, medical equipment and other industries. Ordinary metals and alloys (iron, copper, aluminum, magnesium, zinc and all other metals), rare metals and alloys (gold, silver, titanium), metal oxides, special surface treatment (phosphate, aluminum anodizing, plating surface), ABS material (electrical appliances, housing, commodities), ink (translucent keys, print products), epoxy resin (electronic components, packaging, insulation layer). Product parameters: Equipment Type: MHB60 Laser wavelength: 1064nm Beam quality: m2 <6 Laser repetition rate: ≤ 50 KHz Standard marking area: 110 × 110mm Optional marking range: 100 × 100/150 × 150/200 × 200mm Carving depth: 0.3mm (depending on material adjustable) Engraving line speed: ≤ 7000mm/s Min line width: 0.02mm Min character: 0.25mm Repeat precision: ± 0.001mm Machine power consumption: ≤ 1.5KW Electricity demand: 220V/50- 60Hz Cooling method: Internal circulating water cooling Random accessories: 3D working table, one water-cooled machine

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