Diode Side Pump Laser Marking Machine

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Diode Side Pump Laser Marking Machine
Posting date : Oct 11, 2010
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Free Member Scince Sep 25, 2010
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84-
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Detailed Description
Features 1 Unique "V" shaped laser cavity, higher beam quality in the same power output. 2 Straight cavity semiconductor model dedicated to production lines and automated production line equipment. 3 Higher Laser quality (M2 ≤ 6), smaller spot, intensified energy. 4 Maintenance-free, requires no consumables, longer average failure-free working 5 Red light positioning system, easy to operate. 6 Improved cooling system, smaller size, and better effect. Applications 1 Can mark all metals and a great many of non-metal materials. 2 Suitable for applications that requires high precision and accuracy in depth markings. 3 Widely used in electrical components, integrated chips(IC), electric appliance, communication equipments, tools, precise machinery, glass frames, clocks and watches, accessories, automotive accessories, plastic buttons, construction material, packaging, PVC pipes and medical instrument processing and manufacturing Technical Specification Model CX-Q90/50W CX-Q90/75W CX-Q90/100W Max. Laser power 50W 75W 100W Laser wavelength 1064nm 1064nm 1064nm Beam quality M2 ≤6 Laser repetition frequency ≤30KHZ ≤30KHZ ≤30KHZ Marking area 70mm*70mm (Standard) Adjustable marking area 110mm*110mm/170mm*170mm Marking depth ≤0.30mm ≤0.40mm ≤0.40mm Marking linear speed ≤7000mm/s ≤7000mm/s ≤7000mm/s Min. linear width 0.01mm Min. character 0.3mm 0.3mm 0.3mm Repetition accuracy ±0.003mm ±0.003mm ±0.003mm Rated power consumption 1.5KW 2KW 2KW Supply voltage 220V//50HZ/8A 220V//50HZ/10A (Optional multi-position indexing marking matching system)

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