silicon thermal compound/heat sink thermal compound with SGS&ROHS

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HEAT SINK COMPOUND/ THERMAL COMPOUND is a white paste silicone product which is heavily filled with heat-conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. This system is very stable to the change of temperature. It helps to maintain a positive heat sink seal that improves heat transfer from the electrical / electronic devices to the heat sink or chassis, thereby increasing overall efficiency of the devices. Applied industries: speciality electronic and electrical products Specification Parameter Units Condition Test Method Test Result Color N/A 25 Visual Grey Thermal Conductivity W/m-K No ROCT8.140-82 0.965 Thermal Impedance -in2/W 25 ASTM D1470 0.225 Specific Gravity N/A 25 ASTM D1475 2.3 Evaporation % 150/24Hours Fed.Std.791 0.001 Bleed % 150/24Hours Fed.Std.791 0.05 Dielectric Constant A N/A 100Hz ASTM D150 5.1 Viscosity N/A 25 ____ no flowing Thixotropic Index 1/10 mm 25 GB/T-269 380±10 N/A N/A -50~240 Operation Temperture N/A N/A -30~180 Component Silicone Compounds 50% Carbon Compounds 20% Metal Oxide Compounds 30% Package ST SP TU CN Item No. Color out package soft package mini bag short tube can ST360 grey red N/A 0.5g 1g 1.5g 0.5g 1g 1.5g 30g , 150g , 1kg

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GUANGZHOU RICHONE ELECTRONIC CO.,LTD

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