8 layers,ENIG,buried and blind of Use to mobile telephone PCB

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8 layers,ENIG,buried and blind of Use to mobile telephone PCB
Posting date : Feb 09, 2009
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HS-CODE
85-
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Detailed Description
Material:FR4 With blind and buried holes(L1-L2,L2-L3,L7-L8,L2-L7) Surface treament:immersion gold Solder mask:green Min hole size:0.1mm Track space:0.1mm

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