extra-thinness micro-hole multiplayer

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extra-thinness micro-hole multiplayer
Posting date : Oct 30, 2008
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85-
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Used material: FR4,CEM3,CEM1 Max layer: 8 layers Maximum board size: 20inch*24inch 500mm*600mm Minimum board thickness(outer): 12 mil 0.30 mm 2 L 24 mil 0.60 mm 4 L 48 mil 1.20 mm 6 L 64 mil 1.60 mm 8 L Minimum board thickness(inner): 12 mil 0.30 mm Maximum aspect ratio: 8:1 8:1 Minimum SMD spacing: 4 mil 0.1mm Minimum finished hole size: 8 mil 0.2mm Layer count: 2-8 L Minimum trace space/width: 4mil 0.1mm Multilayer registration accuracy: ± 3 mil ±0.075mm Accuracy of outline: ± 4 mil ±0.1m Maximum copper weight: 3OZ Control impendence: 10% Blind/buried via: Y Relative compliance: ISO9001:2000,ISO/TS16949:2002,ISO14001:2004,UL

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