fully automated high-speed membane bonding device

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fully automated high-speed membane bonding device
Posting date : Nov 02, 2006
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85-
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First pls add my msn:pcperipherals-mz@hotmail.com following is the technology specification: Max sheet size:910mmx(L)1000(W) MIN sheet size:300mm(L)X300MM(W) laminating speed:200kg/cm laminating temperature:150dgree dust clean temperature:60degree required power supply:59kw machine dimension:9385X1910X2755mm gross weight:6500kg

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