10 layers with blind and buried vias

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10 layers with blind and buried vias
Posting date : Feb 28, 2008
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Free Member Scince Feb 28, 2008
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HS-CODE
85-
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Detailed Description
Base material :FR4 Thickness :2.5(mm) Layer : 10 layers with blind and buried vias Min. hole size :0.4mm Thickness of copper foil in internal/external layer :175μm Final Finishing : HASL Application : Mainly using for telecommunication switching system

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