tin-lead solder ball

본문 바로가기


Home > Product > tin-lead solder ball
Product
tin-lead solder ball
Posting date : Jan 03, 2008
Membership
Free Member Scince Jan 03, 2008
Keyword :
Category
Contact
          0 likes     
Product Detail
Company Info
 
Quick Detail
Place of Origin
HS-CODE
84-
Package & Delivery Lead Time
Detailed Description
The solder ball has good advantages of high pureness and cleanness, lustrous, uniform particles and exact weight . Common solder ball Sn63Pb37 Sn62Pb36Ag2 Sn60Pb40 Sn10Pb90 Model For PBGA For CSP For monotype BGA We can supply solder balls in different alloy according to customers’ requirement. Solder Balls used for BGA 、CSP and Flip Chip packages have many kinds of manufacturing, such as :atomizing (19 processes)etc. Doublink Great Wall Tinny Solders Co., LTD adopts special manufacturing process, reaches a high lever on the quality and characteristics , makes a high working efficiency and satisfies customer’s demand.

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
About Us Privacy Policy Terms of use Copyright © 2000-2024 ECROBOT.COM. All rights reserved.
Top