Lead-free solder ball

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Lead-free solder ball
Posting date : Jan 03, 2008
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HS-CODE
84-
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Detailed Description
The solder ball has good advantages of high pureness and cleanness, lustrous, uniform particles and exact weight . Lead-free solder ball Alloy: 1.Sn-Ag 2.Sn-Cu 3.Sn-Ag-Cu-Sp 4.according to the customers requirement We can supply solder balls in different alloy according to customers’ requirement. Solder Balls used for BGA 、CSP and Flip Chip packages have many kinds of manufacturing, such as :atomizing (19 processes)etc. Doublink Great Wall Tinny Solders Co., LTD adopts special manufacturing process, reaches a high lever on the quality and characteristics , makes a high working efficiency and satisfies customer’s demand.

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
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