Radio-Frequency Plasma System AS-V100

Radio-Frequency Plasma System AS-V100

Descpiton :

Plasma treatment is an effective surface processing solution for various materials, including resins, ceramics, metals, and composite materials. It is widely used for contaminant removal, desmear and etch-back, carbon removal, and PTFE surface activation. These treatments enhance material properties and increase surface energy, resulting in better adhesion and durability. This is crucial for a wide range of industries, such as PCB and HDI manufacturing, semiconductor packaging, medical device processing, and automotive decoration cleaning.

The AS-V100 plasma system is designed based on years of close collaboration with PCB manufacturing plants and users from other industries. With its outstanding treatment uniformity and environmentally friendly process, the AS-V100 is a mature solution that meets the process requirements of these diverse application fields.

Main Applications & Benefits:

1.Desmear and etch-back, as well as contaminant removal, after laser drilling of vias.

2.Removal of carbides generated by laser blind hole drilling.

3.Removal of dry film residues during fine line creation.

4.Surface activation for PTFE materials before the PTH process.

5.Surface activation before inner layer lamination.

6.Surface activation before immersion gold.

7.Surface modification to enhance morphology and wettability, thereby increasing the bonding force between layers.

Features & Performance:

1.User-friendly automatic control interface with a touch screen for easy operation.

2.Unique cavity design ensures excellent cleaning uniformity and high cleaning quality.

3.Utilizes a two-layer structure with 4-6 material boxes per layer, combining chemical reactivity and physical impact for a short cleaning cycle and high efficiency.

4.Plasma cleaning offers high repeatability, strong controllability, high utilization rate, and operates with no pollution and low operating costs.

5.Features a simple structure, compact footprint, high efficiency, easy operation and maintenance, fast speed, and stable performance.

6.Enhances the surface wetting ability of the lead frame or substrate before D/A, ensuring precision and firmness in subsequent processes.

Product Specifications:

1.Outline Dimensions (footprint):1200*800*1750H mm

2.Vacuum chamber size:450*450*610mm

3.Power frequency:13.56MHz

4.Power supply:1Kw

5.Electrode plate specifications:Non-standard customization

6.Software control:PLC touch screen

7.Gas purity requirement:Industrial grade gas or better

8.Loadable gas:O2，N2，Ar

Merits:

Environmentally friendly molecular-level surface cleaning enhances uniformity and hydrophilicity, making it an ideal pre-treatment for bonding processes.

Application fields:

Suitable for PCBs,FPC， IC substrates, LCDs, PV batteries, semiconductors, PTFE, automotive interior parts, medical equipment, plastic and rubber products.