High-Volume Vertical Plasma System AV-P30

High-Volume Vertical Plasma System AV-P30

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PCB Plasma Desmear

IC substracts Plasma treatment

LCD Plasma Cleaning

LED Plasma Desmear

PTFE Plasma treatment

Descpiton :

Plasma treatment is an effective surface processing solution for various materials, including resins, ceramics, metals, and composite materials. It is widely used for contaminant removal, desmear and etch-back, carbon removal, and PTFE surface activation. These treatments enhance material properties and increase surface energy, resulting in better adhesion and durability. This is crucial for a wide range of industries, such as PCB and HDI manufacturing, semiconductor packaging, medical device processing, and automotive decoration cleaning.

The AV-P30 plasma system is designed based on years of close collaboration with PCB manufacturing plants and users from other industries. With its outstanding treatment uniformity and environmentally friendly process, the AV-P30 is a mature solution that meets the process requirements of these diverse application fields.

Main Applications & Benefits:

1.Desmear and etch-back, as well as contaminant removal, after laser drilling of vias.

2.Removal of carbides generated by laser blind hole drilling.

3.Removal of dry film residues during fine line creation.

4.Surface activation for PTFE materials before the PTH process.

5.Surface activation before inner layer lamination.

6.Surface activation before immersion gold.

7.Surface modification to enhance morphology and wettability, thereby increasing the bonding force between layers.

Features & Performance:

1.Excellent plasma treatment uniformity achieved through an advanced upper air intake and lower air extraction system, coupled with a power-power electrode design.

2.Intelligent system featuring real-time display of each workpiece status, along with safety protection functions such as air shortage, pressure protection, and circuit protection.

3.Optimized cooling channels guide cooling water in a regulated direction to ensure temperature uniformity and a long service cycle.

4.High cooling performance with two separate water channels for the vacuum chamber and dry pump.

5.Large capacity and high efficiency at a low average cost.

Product Specifications:

1.Outline Dimensions (footprint): 2380*2150D*2200mm

2.Vacuum Chamber Dimensions: 1445*1265D*1055mm

3.Maximum Treatment Area: 1120*635mm

4.Maximum Treatment Cells: 15

5.Rating Voltage: 3-Phase 380 VAC~440V, 50 Hz/60 Hz

6.Output Frequency: 40 kHz

7.Output Power: 10 kW

8.Discharge Vacuum Degree: 20~80 Pa

9.Loadable Gases: O2, N2, H2, CF4

10.Treatment Time for Each Batch: 15~30 minutes

Merits:

Environmentally friendly molecular-level surface cleaning enhances uniformity and hydrophilicity, making it an ideal pre-treatment for bonding processes.

Application fields:

Suitable for PCBs, IC substrates, LEDs, LCDs, PV batteries, semiconductors, PTFE, automotive interior parts, medical equipment, plastic and rubber products.