Article |
Description |
Capability |
Material |
Laminate materials |
FR4,Alu,CEM3,Taconic,Rogers |
Board cutting |
Number of layers |
1-58 |
Min. Thickness for inner layers (Cu thickness are excluded) |
0.003”(0.07mm) |
|
Board thickness |
Standard |
0.04-0.16”±10%(0.1-4mm±10%) |
Min. |
Single/Double layer: 0.008±0.004” |
|
4 layer: 0.01±0.008” |
||
8 layer: 0.01±0.008” |
||
Bow and twist |
<7/1000 |
|
Copper weight |
Outer Cu weight |
0.5-4 oz |
Inner Cu weight |
0.5-3 oz |
|
Drilling |
Min size |
0.0078” (0.2mm) |
Drill deviation |
±0.002” (0.05mm) |
|
PTH hole tolerance |
±0.002” (0.005mm) |
|
NPTH hole tolerance |
±0.002” (0.005mm) |
|
Plating |
Min hole size |
0.0008” (0.02mm) |
Aspect ratio |
20 (5:1) |
|
Solder mask |
Color |
Green,white,black,red,yellow,blue... |
Min solder mask clearanace |
0.003” (0.07mm) |
|
Thickness |
0.0005-0.0007”(0.012-0.017mm) |
|
Silkscreen |
Color |
White,black,yellow,red,blue... |
Min size |
0.006” (0.15mm) |
|
E-test |
Flying Probe Tester |
Y |
Controlled Impedance |
Tolerance |
±10% |
Impedance tester |
Tektronix TDS8200 |
|
Surface Finish |
HASL,ENIG,immersion silver,immersion tin,OSP... |