PCB Capability
Items | Normal standard | Ultimate |
Material | FR-4;High TG FR-4;CEM-3;CEM-4 | Al-base |
Layer NO. | 1-20 | 40 |
Board Size | 50mm*50mm-560mm*640mm | 35mm*50mm |
Board Thickness | 0.4mm-4.0mm | 0.3mm-6.0mm |
Thickness Tolerance | ±10% | ±7% |
Min Hole Size | 0.2mm | 0.15mm |
Copper Thickness | 18um-105um | 18um-420um |
Copper Plating hole | 18um-30um | 18um-40um |
Min Trace Width | 0.1mm | 0.75mm |
Min Space Width | 0.1mm | 0.75mm |
SMD Pitch | 0.4mm | 0.4mm |
BGA Pitch | 0.6mm | 0.6mm |
Min Annular Ring | 0.07mm | 0.05mm |
Register Tolerance | 0.05mm | 0.025mm |
Solder Mask Color | green;blue;black;red | white; yellow |
Peelable Mask | 0.3mm | 0.5mm |
HASL Thickness | 2.5um | |
lead Free HASL | 2.5um | |
Immersion Gold | Nickel:47um Au:0.05um | Nickel:7um Au:0.2um |
OSP Thickness | 0.2-2.5um | |
Outline Tolerance | CNC:±0.1mm; V-CUT:±0.1mm; Punching:±0.15mm | |
Impedance Control | ±10% | ±7% |
Warpage | Less than 1% | Less than 0.7% |
certificate | ISO9001;TS16949 |
Quantity |
Prototype&Low Volume PCB Assembly,from 1 Board to 250, is specialty,or up to 1000 |
Type of Assembly | SMT,Thru-hole, DIP |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
File Formate | Bill of Materials Gerber files Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing |
Flying Probe Test,X-ray Inspection AOI Test |