ML Series 3D Color SPI Solder Paste Inspection Equipment 700mm/S Speed , ON Line ML-V850/V850L

Quick Detail

Package & Delivery Lead Time

Detailed Description

ML Series 3D Color SPI Solder Paste Inspection Equipment 700mm/S Speed , ON Line ML-V850/V850L - - - - Types | Items | Specifications | Inspection | Camera | Digital High Speed CCD 5M Pix | Light | Ring R/G/B LED and White LED | FOV | 32mm*32mm(20m) | Speed Per FOV | <0.6s | Detect | Solder/Red gum: Volume,Area,Height,Shape,Shift,Bridge,Overflow | Defect | None,Shift,More,Less,Bridge,Pull,Shape,Gold finger,Height,Overflow | Height Range | 10~400um | Area Range | 0.15mm0.15mm~10mm10mm | Height Accuracy on a Certificated Target | 1m | Height/Area/Volume Repeatability on a Certificated Target | <1m@3sigma | GR&R | <10% | Software | OS | Windows 7 | Vision | Spec. | Dual 3D Projection(Single optional)avoid shadow and reflection | UI | GUI/Easy use,support English/Chinese/Big5 | Result | 2D/3D 2D/3D true color | MARK | 2 Marks/Board or 2 Marks/Array, support bad mark | Program | Gerber 274D/X,CAD,Offline program,Bare Board Teach | SPC | Offline SPC | Support | Chart | Any Time Chart | Histogram/Control/Compare chart | Volume,Area,Height,Shift | Export | Excel,Jpg,Bmp | Hardware | PCB Transmit | 900200mm Bottom-up fix; Auto transmit and width correct based on SMEMA;Height: 900200mm | PCB Size | 50mmx50mm`330mmx250mm, 80mmx80mm`460mmx510mm | PCB Thickness | 0.5mm~5.0mm | Max PCB Warp | <2mm | X,Y Station | Motion | Servo Motor Control | Position Accuracy | <1m | Speed | 700mm/s | Control | Computer | Industrial computer:Intel 4 core/8G DDR/500G HD | Display Output | 19 inch LCD | Others | Machine Dimensions | 100cmx100cmx155cm | Weight | 710kg 800K | Power Supply | AC220V10%,50/60Hz,1200W | Environment | Temperature: 10-40,Humidity: 30-80%RH | - - - -

Basic Company Information

Morel Equipments Co.,Ltd

Company Advantage

Detail Company Introduction