HDI Pcb

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FR4 HDI PCB Printed circuit boardsHigh Density Interconnect  HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB. HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and micro-sized vias. HDI PCB manufacturing is a growing area since the market demand for lightweight and thinner PCBs that can handle high-speed signals with reduced signal loss has steadily increased as consumer electronic end-products are produced in smaller form factors. As a result of the market demand for HDI PCB manufacturing, XCEPCBhas served clients from many industries, including:Automotive (Engine Control Units, GPS, Dashboard Electronics)Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)Communication (Mobile phones, Modules, Routers, Switches)Digitial (Cameras, Audio, Video)FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as "copperclad laminates."  FR-4 copper-clad sheets are fabricated with circuitry interconnections etched into copper layers to produce printed circuit boards. More sophisticated and complex FR-4 printed circuit boards are produced in multiple layers, also known as "multilayer circuitry".  Specifications When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately.  In the USA, FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254µm) to 3 inches (76 mm). In the USA, copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2(300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1µm (1.34 thou), 68.2µm (2.68 thou), and 102.3µm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35µm (may also be referred to as 35 μ, 35 micron, or 35 mic).  1/0 - denotes 1 oz/ft2 copper one side, with no copper on the other side. 1/1 - denotes 1 oz/ft2 copper on both sides. H/0 or H/H - denotes 0.5 oz/ft2 copper on one or both sides, respectively. 2/0 or 2/2 - denotes 2 oz/ft2 copper on one or both sides, respectively. Our manufacturing facilities have the following HDI PCB manufacturing capabilities:Buried, Blind and Micro ViasNCVFCopper FillSequential Lamination3/3 Traces/Space5% Impedance　Products Details   Raw Material FR-4 (Tg 170 available) Layer Count 4-LayerSize 18*26cmBoard Thickness 1.2mmCopper Thickness 1.0ozSurface Finish ENIG(Electroless Nickel Immersion Gold)Solder Mask BlueSilkscreen WhiteMin. Trace Width/Spacing 0.075/0.075mmMin. Hole Size 0.25mmHole Wall Copper Thickness ≥20μmMeasurement 300×400mmPackaging Inner: Vacuum-packed in soft plastic bales   Outer: Cardboard Cartons with double strapsApplication Communication,automobile,cell,computer,medicalAdvantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,Special Requirements Buried And Blind Via, Impedance Control, Via Plug,   BGA Soldering And Gold Finger Are AcceptableCertification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREETechnical specifications Annual stock MaterialRogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen freeLayer No.1~16Min board thickness 2 layer0.2mm                                   4 layer0.4mm                                     6 layer 0.6mm                                   8 layer 0.8mm                                   10 layer 1.0mmMax panel size508*610mmBoard thickness toleranceT≥0.8mm±8%.,T<0.8mm±5%Wall hole copper thickness>0.025mm(1mil)Finished hole0.2mm-6.3mmMin line width4mil/4mil(0.1/0.1mm)Min bonding pad space0.1mm(4mil)PTH aperture tolerance±0.075mm(3mil)NPTH aperture tolerance±0.05mm(2mil)Hole site deviation±0.05mm(2mil)Profile tolerance±0.10mm(4mil)Board bend&warp≤0.7%Insulation resistance>1012ΩnormalThrough-hole resistance300ΩnormalElectric strength>1.3kv/mmCurrent breakdown10APeel strength1.4N/mmSoldmask regidity >6HThermal stress288℃20SecTesting voltage50-300VMin buried blind via0.2mm(8mil)Outer copper thickness1oz-5ozInner cooper thickness1/2 oz-4ozAspect ratio8:1SMT min green oil width0.08mmMin green oil open window0.05mmInsulation layer thickless0.075mm-5mmTaphole aperture0.2mm-0.6mmSpecial technologyIndepedance,Blind buried via,thick gold,aluminum PCBSurface finishHASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating url:http://www.xce-pcb.com

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XINCHENGER ELECTRONICS(HK) CO.,LTD

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