General specification for Multi-layer printed circuit board

1, 4-38 layers

2, Board finished thickness: 0.3mm-7.0mm

3, Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers, Telfon.

4, Max. Finished board size: 23*25(580*900mm)

5, Min. Drilled hole size: 6mil(0.15mm)

6, Min. Line width: 3mil(0.075mm), Min. Line spacing: 3mil(0.075mm)

7, Surface finish/treatment: HASL/HASL lead free, Chemical tin, ENIG,Immersion Silver, OSP, etc.

8, Copper thickness: 0.5-20 oz

9, Solder mask color: Green/yellow/black/white/red/blue

10, Copper thickness in hole: >25.0 um(>1mil)

12L multilayer pcb       

Technical description,        

Material: FR-4 Tg170       

Board thickness: 1.6mm        

Surface finished: Immersion gold+Controlled Impedance       

Copper thickness: 1 Oz for all layers        

Min.line width/space: 4mil       

Min through hole: 0.15mm