PVD magnetron sputtering coating machine | Global Trade leader ecrobot

Product

PVD magnetron sputtering coating machine

Posting date : Jul 25, 2016

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Membership

Free Member Scince Jul 25, 2016

FOB Price

negotiable

Min. Order Quantity

1 set

Supply Abillity

5 sets per month

Port

Shanghai

Payment Terms

50% for deposit by T/T, balance after inspection

Package

Standard export packing

Keyword :

magntron sputtering

Category

MACHINERY & ELECTRICAL | Electrical | Electrical | Machines &

Contact

Jane LIU

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Product Detail

Company Info

Quick Detail

Place of Origin

China [CN]

Brand Name

Hongfeng VAC

Model Number

SP-900

HS-CODE

8543-30

Package & Delivery Lead Time

Package

Standard export packing

Delivery Lead Time

60 days after order

Detailed Description

PVD magnetron sputtering coating machine

Sputtering using gas discharge positive ions under the electric field high speed bombardment cathode target, so that the target of the escape of atoms or molecules deposited on the surface of the substrate to be plated to form the desired film. With this approach to vacuum coating, film effect will be different, though our eyes can not be seen directly, but it has certain advantages.First, a wide range of plating materialUnlike the sputtered film evaporation coating due to the melting point and can only restrict the use of relatively low melting point metal plating, sputtering film by argon ion bombardment speed plating material sputtered, almost all of the solid material can be a coating material.Second, the film thickness of better stabilityBecause sputtering and sputter-coated layer thickness and the target current having a very large discharge current relationship, the higher the current, the greater the efficiency of sputtering, in the same time, the thickness of the coating layer is also relatively large. As long as the current value of good control within an allowable range and more want to thin the thick plating can be. And as long as good control of current, no matter how many times repeated plating, the film thickness will not change, which will see its stability.Third, the combination of strong filmDuring sputtering, the electrons strike the part to the substrate surface, and activating the surface atoms, and the cleaning action generated, and the energy plated material obtained by sputtering evaporation higher than the energy obtained by 1-2 orders of magnitude, with when there is such a high-energy atomic strike plating material to the substrate surface, more energy can be transferred to a substrate, produce more heat, so that the atoms are electronically activated accelerated motion, with some plating materials earlier each atom fused together, tight as other plating material atoms deposited in a film after another, strengthening the binding force of the film to the substrate.

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