PCB Capability
Material: FR4, CEM-3, Halogen Free, Rogers, High TG etc.
Layer counts: 1-18 layers
Finished Copper Thickness: 0.5-4 OZ
Finished Board Thickness: 0.2-5.0mm
Min. Line/Track Width: 4mil
Min. Line/Track Space: 4mil
Min. Contour Tolerance: +/-0.1mm
Min. Finished Diameter of PTH Hole: 0.2mm
Max. Board Thickness/Hole Ratio: 12:1
Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil)
Min. Legend (Silk screen) Track Width: 5mil
Min. Legend (Silk screen) Height: 30mil
Min. drilling slot size: 0.6mm
Solder mask color: green, black, blue, white, yellow, purple, and matt, etc.
Legend/Silk screen Color: white, yellow, black, etc.
Surface Treatment: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc.
Other Technology: Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc.
Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis, etc.
Bow and twist: ≤1%
Flammability: 94V-0
4. Professional engineering staff to provide technical support.
5.OEM and ODM service are welcome.
Packaging Detail: Vacuum packaging
Delivery Time: 10-15 days