High Density Interconnect PCB

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Product
High Density Interconnect PCB
Posting date : Dec 31, 2015
Membership
Free Member Scince Nov 30, 2015
FOB Price
Negotiable
Min. Order Quantity
500
Supply Abillity
500000
Port
Shanghai, Hongkong
Payment Terms
T/T, western union, Paypal
Package
According to customers' requirement
Keyword :
Category
Contact
Susie Zhao
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Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
Hityech pcb
Model Number
As request
HS-CODE
8548-90
Package & Delivery Lead Time
Package
According to customers' requirement
Delivery Lead Time
2- 10 days
Detailed Description
Layer Count: 10-layers (HDI PCB with3+4+3 stack up)
Mobile Phone main board
Finish board thickness: 1.0mm
Material: FR4, Tg150
Surface finishing: immersion gold+OSP
Line width and space: 0.13/0.13mm
Special technology: HDI PCB with 3 + 4 + 3 Layers, 4mil Blind and 12mil Buried Via
Impedance control tolerance: +/-8%
Through hold size: 0.3mm      

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