CAS:1314-13-2
EINECS:215-222-5
Molecular Formula:ZnO
Molecular Weight:81.39
Appearance:White or light yellow fine powder, odorless, tasteless, Yellow at high temperature and white after …
APOLO C200 could compact large size and lightweight PS material. Production Capacity: 200 kg per hour / 440 lbs per hour.The compacted PS is easy to handle or convenient to transport if recycle or b…
GreenMax compactor series are developed to recycle the Styrofoam, EPE foam, EPP foam, etc.Compact all kinds of scattered EPS and bulk EPS into compact size. The compact size of EPP easy to transport a…
APOLO C100 offer an intelligent and useful tool for recyclers. APOLO C100 could compact all kinds of materials, such as EPS, PSP, XPS and so on. The compacted material is easy to store and transport…
ZEUS C300 is a system that has large mill apart that connects silos, is able to grind various sizes and densities of material. The size of mill and silos can be customized to adapt the customer requ…
ZEUS C100 could prevent the compacted PE Foam, EPS and other material from scattering.Of-course, C100 could offer convenience for recyclers.Applicable material include EPE(PE FOAM), EPP, EPS, XPS an…
GREENMAX ZEUS C200 compactor is a middle size surface melting compactor, the operation is simple and safe. After you put the waste foam into the machine, the crusher can smash the foam into piece, t…
Best Material;Case finish:LATEX BASE COVER technology;More thickProduct detailsColor BlueProduct Keywords measuring tapeFeatures: Best Material Case finish using LATEX BASE COVER t…
T3-T8 Temper and 6000 Series Grade profile aluminum/aluminium extrusion profile
Product Name
Industrial aluminium profile /aluminum extrusion
Material
60…
Diamond Grinding Discs Are Used For Polishing Gemstones (Jade, Crystal, Agate) spinel, sapphire And Applied Extend To Optic Industry, Jewellery, Glass Artwork And Precision Machining Industry.
Th…
Introduction to resin diamond grinding wheel
The resin bond diamond wheels are mainly used for grinding tungsten carbide and non-metal materials. Various kinds of dimensions and shapes are availa…
Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.
…
Introduction to resin diamond grinding wheel
The resin bond diamond wheels are mainly used for grinding tungsten carbide and non-metal materials. Various kinds of dimensions and shapes are availa…
ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea