Typical application
1,It is designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.
2,Primarily used to improve shock resistance (drop&thermal test reliability)
Typical perform…
The detail of lead free solder wire:
1.Size: diameter 0.5~8.0mm
2.Weight:5kg/box, 0.5kg/roll
3.Chemical composition: Sn-Cu, Sn-Ag-Cu, Sn-Ag, Sn-Zn, Sn-in, Sn-Bi
4.have measured up the SGS and E…
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