underfill

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underfill
Posting date : Dec 06, 2010
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HS-CODE
80-
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Detailed Description
Typical application 1,It is designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. 2,Primarily used to improve shock resistance (drop&thermal test reliability) Typical performance High reliability Fast flow Snap-cure consistent dispense properties over many shifts Higher productivity Rworkability Auto filleting Filling in 0.5 mil(0.013mm)gaps

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