plastic encapsulation potting compound electrical led silicone encapsulant

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plastic encapsulation potting compound electrical led silicone encap...
Posting date : Jun 20, 2014
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40-
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We will take every success as starting point and transcend ordinary . If you need to know more details about the business, please contact Miss Li Tel: 13824614495 or 0757-82711866 Email: marketing6@hm-sil.com QQ: 2068610877 http://www.Homeen.cn plastic encapsulation potting compound electrical led silicone encapsulant Our main products include Sealant, Potting adhesive, Encapsulation adhesive, Silicone mould making material Conductive gel, LED glue, New energy glue, Electrical and electronic glue, Coating sealant HM-7101A/B Directions? The HM-7101A/B is formed by two parts potting adhesive, with 1.41 refractive index. Normally used as potting adhesive in LED patch, and high and low power LED module encapsulation like 3014?3528?5050?5630 surface mount devices,this binding agent has good adhesive strength for PPA, PCB and metal material. Parameters? A B Before cured appearance Colorless Transparent Liquid misty-white liquid viscosity 10000cps 2000cps Mixed ratio 1:1 Mixed viscosity 5000cps Curing condition precuring?80?/1hour full cured ?150?/2~4hours After mixed >5hours cured Appearance Transparent hardness 60D refractive index 1.535 Instructions for use? 1. Use the A?B parts according to their mass proportion of 1:1 and conduct the production in the dried and dust-free cirsumstance. 2. Before adhesive dispensing please clean the bracket thoroughly to get rid of the material which may hinder curing of adhesiv from the baseplate 3. Stir by Planetary gravity mixer to make it uniform mixing or emove air bubbles from the adhesive at 45? temperature with 10mmHg vacuum deegree before using 4. The bracket should be heated at 150? for 30 minutes for dehumidification before injection adhesive, and dispense adhesive before the rack absorb moisture again. 5. Heat the bracket in a 80? oven for 1hr then take to another 150? oven bake for 2-4 hours it will be full cured. 6. Put the untapped adhesive into the spotless container for later use Notes? 1. HM-7101A/B is Addition type siliconeelastome,which should not touch some material alkyne,lead,tin,cadmiu,mercury and other heavy metal which may cause uncured or partialy cured.The potting suface must be cleaned before sealing and filling. 2. Different operation will result in various consequences may lead to bubble,barrier,debonding,crack etc. Please refer to associated personel to avoid above occurrenc. 3. Better the vacuumizer is an open system and never use for epoxy resin.The best way is to establish a dedicated organic silicon production line. 4. Please use appropriate container and stirring rod for mixing. And don

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