Low temperature conductive silver plasm

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Low temperature conductive silver plasm
Posting date : Nov 12, 2008
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28-
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Product description This product is use high technology means to make patch copper cover silver particle into plasm, it use copper replace silver, so the price is much better, but the result is same. Product feature Good conductivity, stability chemical characters, low cost and it is not easy oxidation Color: silver yellow Particle diameter: 5μm Content: 43±2% Density: 1.1±0.5g/m3 Adhision degree: 8-16s(25℃) Resistance: ≤0.1Ω/cm Spraying area: 4-10m2 Application range Plus it into rubber, plastic and fabric to form different conductive products All kinds of conductive and guiding static micro-electronics fields Electromagnetism screen, non conductive materials surface Electronics, machine, communication, printing aviation, spaceflight and weapon Notice Before use it, mixing it equality Preservation period: 6 months Drying temperature: 135℃ Keeping away from heat sources, fire and high temperature

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