Electronic Potting Compound silicone

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Specifications Low shrinkage Easy Operation Samples are available Fast delivery Large quantity supply Electronic Potting Compound silicone 9055 Product Description Typical Application of Electronic Potting Compound silicone: HY9055 is suitable for bonded seal of electronic components, power module and control module, LED invertor potting, etc which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. Product Feature of Electronic Potting Compound silicone: It can be applied to the sealing and pouring of various electronic components, and then forming insulation system with no corrosion and negligible shrinkage. Room temperature vulcanize, and easy to operate; Maintain flexibility at a wide temperature range, and excellent insulation performance; Waterproof, moisture-proof, mouldproof, dustproof, and stable components; Resistance to Chemical dielectric, anti-yellowing, resistance to climate ageing. Technical Parameters of Electronic Potting Compound silicone: Before Curing Appearence Black Fluid Density(25°C g/ml) 0.98±0.02 Viscosisty(25°Ccps) Part A 2500±500;Part B:2500±500 Mixing Ratio A:B=1:1(By weight) Operating Time(25°C min) 120 Curing time(25°C min) 480 Curing time(80°C min) 20 After Curing Hardness(Shore A) 50-60 Dielectric Strength(KV/mm) 23 Volume Resistance(Ω.Cm) 1.0×10 15 Permittivity(1.2MHz) 3.0 Temperature Resistence(°C) -60~200 Fire Resistance UL94-V1 Arc Resistance 250V (Pls note: the above data for this product in 25 °C temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers to when using. The appearance can be adjusted by our technical department if required.) TECHNICAL GUIDELINES of Electronic Potting Compound silicone: 1, Pls put part A and part B in separate container and stir evenly before mixing the two part together. 2, Weight Ratio: part A: part B = 1:1 3, Deaeration the mixture under 0.08 MPa for 3 minutes. 4, The temperature influences the curing time of 9301. When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. Warm Tips of Electronic Potting Compound silicone: 1.The following material may hinder the curing of the product, So pls apply after summary experiment. When necessary, pls clean the application areas. l Condensation silicone which not completely cured or organic tin compounds l Sulphur, sulfide and sulfur rubber materials. l Amine compounds as well as contains the amine materials. l Pewters solder flux. 2. Should be sealed storage.The mixture should be used up at once, avoid causing waste. 3. Silicone belongs to non-dangerous goods, but keep away from mouth and eyes. 4. When it gets stratified after a period of storage, Please mix 9301 evenly before using, it does not affect the performance. Packaging & Shipping PACKAGE 20Kg/pail (Part A10Kg + Part B10Kg)

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Shenzhen Hongyejie Technology Co., Ltd

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