one-component epoxy resin glue

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one-component epoxy resin glue
Posting date : Apr 04, 2014
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11-
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Detailed Description
ne-component epoxy resin glue 1. Product Description: 1). Excellent adhesion to phenolic abrasive cloth, ceramics, electroplating metal, waterproof abrasive paper, iron core, fiberglass cloth and circuit boards. 2). Heat-resistant. It can work under the temperature between 160 to 200℃ with little damage of adhesion strength. 3). High toughness. It can bear thermal shock and impacts during -30~140℃. 4). Good flow-resistance and impermeability. 5). Low expansion rate. It will not easily falloff the bonded materials when temperature varies. 6). Very suitable for such circumstances which calls for high demands on adhesion ability under high temperature and strain capacity. 2. Storage Instruction: The glue should be stored in dry places under low temperature. If you apply a freezer for storage, please keep the glue back to the room temperature (25 ℃) before use. 3. Our Characteristics: We possess more than three years' professional producing experience of the glue, and the formula is developed by the company technical personnel meticulously. Until now, the production technology proves to be quite mature and stable, and the one-component epoxy resin glue we developed have been sold throughout the country in large quantities and won much praise and referrals. We sincerely welcome every old or new customers to contact with us! 4. Curing performance: (The following data are achieved under experimental environment of room temperature at 30 ℃ and humidity at 70% , for reference only) Volume resistance (25℃) Ohm-cm 2.9×10 Voltage resistance Kv/mm 20~22 Tensile strength Mpa 125 Shearing strength Mpa 85 Hardness shoreD 84 Distortion temperature ℃ 158 linear expansivity rate Cm/cm/℃ 47×10 Resistance to sedimentation Product Density Uniform, no delamination Trixtropy Index 75/750 shift 1.45 Water absorption (℃) % 24 hour 0.05

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