Noble Metal Initiator Prior to EN on Cu DEUTEQ ACTEQ 353

본문 바로가기


Home > Product > Noble Metal Initiator Prior to EN on Cu DEUTEQ ACTEQ 353
Product
Noble Metal Initiator Prior to EN on Cu DEUTEQ ACTEQ 353
Posting date : Mar 12, 2014
Membership
Free Member Scince Dec 07, 2012
Keyword :
Category
Contact
          0 likes     
Product Detail
Company Info
 
Quick Detail
Place of Origin
HS-CODE
38-
Package & Delivery Lead Time
Detailed Description
DEUTEQ ACTEQ 353 Noble Metal Initiator Prior to EN on Cu Introduction 1. An acidic initiator used on non-catalytic copper surfaces prior to processing in electroless nickel. 2. Produces a thin metallic film on the surface of the copper which promotes the formation of a dense, adherent, fine-grained deposit in the subsequent electroless nickel plating solution. Operating Conditions DEUTEQ ACTEQ 353 2 to 5% by volume DI Water 92-95% by volume Hydrochloric Acid 37% 3% by volume Temperature 25-32 °C Time 1-5min

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
About Us Privacy Policy Terms of use Copyright © 2000-2024 ECROBOT.COM. All rights reserved.
Top