TM-QW Series Spherical Alumina Filler

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TM-QW Series Spherical Alumina Filler
Posting date : Dec 28, 2013
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28-
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Features: 1) High filling: Particle size distribution is reasonable, filling efficiency as resin filler is high, and compound of low viscosity and good fluidity can be made. 2) High thermal conductivity: Filling degree is high. Compared with the thermal conductivity of crystalline silicon, that of mixture is higher. 3) Low wear rate: It appears spherical. It wears less on the mixer and molding tool. 4) Electrical and moisture resistance: There is a very small content of ion impurities, such as Na and Cl, so it has good electrical and moisture resistance. 5) Particle Morphology: Equant diameter sphere, High surface smoothness Applications: 1) Heat sink: radiating substrate filler, heat sinking oil, phase change film 2) Semiconductor filler 3) Special air abrasive 4) Organosilicon heat sinking adhesive and mixture filler 5) Ceramic filter membrane 6) Coated powder, etc. Main Technical Parameters of TM-QW Series Spherical Alumina Filler: Index Type D50 (um) Specific Surface Area (m2/g) Chemical Composition (wt/%) Bulk Density (g/cm3) L.O.I. (0-1100degree centigrade) SiO2 (%) Fe2O3 (%) T-Na2O (%) EC (uS/cm) Na+ (ppm) Cl- (ppm) QW-P03 3±0.5 0.7 <=0.10 <=0.03 <=0.015 <=8 <=8 <=1 1.0 <=0.03 QW-P05 5±1 0.6 <=0.10 <=0.03 <=0.015 <=8 <=8 <=1 1.3 <=0.03 QW-P10 9±1 0.4 <=0.10 <=0.03 <=0.015 <=8 <=8 <=1 1.6 <=0.03 QW-P20 20±1 0.2 <=0.05 <=0.02 <=0.01 <=6 <=6 <=0.5 2.1 <=0.02 QW-P30 28±2 0.2 <=0.05 <=0.02 <=0.01 <=5 <=6 <=0.5 2.1 <=0.02 QW-P45 40±2 0.2 <=0.05 <=0.02 <=0.01 <=3 <=6 <=0.5 2.2 <=0.02 QW-N03 3±0.5 0.7 <=0.2 <=0.04 <=0.2 <=160 <=180 <=2 1.0 <=0.03 QW-N05 5±1 0.6 <=0.2 <=0.04 <=0.2 <=160 <=180 <=2 1.3 <=0.03 QW-N10 9±1 0.4 <=0.2 <=0.04 <=0.2 <=120 <=150 <=2 1.6 <=0.03 QW-N20 20±1 0.2 <=0.15 <=0.03 <=0.15 <=120 <=120 <=1 2.0 <=0.02 QW-N30 28±2 0.2 <=0.15 <=0.03 <=0.15 <=80 <=80 <=1 2.0 <=0.02 QW-N45 40±2 0.2 <=0.15 <=0.03 <=0.15 <=55 <=50 <=1 2.1 <=0.02

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