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Place of Origin
HS-CODE
84-
Package & Delivery Lead Time
Detailed Description
INTRODUCTION:
The new generation of laser scribing machines are capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar
energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are
manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system.
FEATURES:
1. Excellent beam quality and system reliability
2. High-speed scribing (up to 300 mm/s), very low-defective index,
3. Auto cooling system
4. Precise CNC worktable
5.Friendly man-machine interface and simple software operation
TECHNICAL PARAMETERS:
Model YMS-10D YMS-50
Laser: Diode pumped Lamp pumped
Scribing speed, mm/s: 300 120
Min kerf width, mm: 0.02 0.05
Frequency, kHz: 0-100 0.5-50
Cooling medium: Air DI Water
Pumping source life,h:20,000 800-1,000
Maintenance interval, month:12 3
Optics alignment: Easy Not easy
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