Aluminum Copper Clad Laminate ALCCL
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China [CN] |
Material |
Sandwich structure, which includes layers of conductor, insulator and met High thermal conductive AL base CCL al base (Aluminum Based). |
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Standard Size (mm) |
500×610mm,550×610mm,550×1220mm,550×1220mm,1000×1220mm,1100×1220mm |
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Circuit Layer(copper foil ) |
18μm,35μm,70μm,105μm(Hoz,1oz,2oz, 3oz) |
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Thermal Dielectric Layer Thickness |
75μm,100μm,125μm,150μm,(3mil,4mil,5mil,6mil) |
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Thickness |
0.8mm,1.0mm,1.2mm,1.5mm,1.5mm,2.0mm |
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Aluminum Substrate Type |
1100,1060,3003,5052,6061 Anodization |
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Masking Film |
PE,PET,PI |
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Using scope |
LED lighting, public lighting, Backlight module, outdoor LED display , Industrial electronics |
The Thermal conductivity is 1.0-3.0W/M. K, It can fit the demand of high end and MID-range products, with high cost performance. All products pass ROSH standard, have good property and meet low-carbon environmental trend. Properities 1. Excellent thermal conductivity 2. Excellent Breakdown Voltage 3. ROSH compliance 4. Excellent solder heat endurance 5. Excellent mechanical properties 6. Excellent electromagnet 7. Can use external cooling device directly 8. High cost performance
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