FS100-GA Thermal Pad gap pad gap filler

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FS100-GA Thermal Pad gap pad gap filler
Posting date : Mar 13, 2013
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Free Member Scince Mar 13, 2013
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CHEMICAL | Inorganic
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HS-CODE
28-
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Detailed Description
Lower interface contact resistance result in better thermal performance. Better shock cushioning as the pad can be half of the thickness under great pressure. Since the pad can receive more pressure, the bond line is very thinner, which generates better thermal performance. Shock-absorbing & vibration-dampening materials for fragile components.
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