Basic Company Information
Lamotek Electronics
TEL : 86-755-25190500 / FAX : 86-755-25190500
Chuanye Road Guangdong Shenzhen China [CN]
Company Advantage
Detail Company Introduction
Lamotek is a professional first-class manufacturer of various special types and multilayer PCB with PCB assembly in China. We also provide consumer electronics OEM case service. After years of continued innovation developmentt, our products include HDI, high frequency, high TG, heavy copper PCB, metal core, mixed dielectric base PCB, flex PCB, along with other high-tech electronic products settlement. And we have offered high quality PCBs to numerous companies in varied industries, like telecommunications, power supply, industrial control, science and education instruments, security systems and medical fields etc.
With advanced management system, talented staffs and high technology, Lamotek take "integrity, speed, quality, service" as our production and management’s concept to constantly expand our business areas, improve quality grades, and meet all needs of customers. Till now, We have established strong partnership with customers all over the world, such as Europe-America, Australia,the Middle East, Southeast Asia and so on .
We believe that we will win the market share of new business opportunities in the ever changing electronics industry.
Specification
1, Layer: 1-22
2, Board finished thickness: 0.21mm-7.0mm
3, Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers
4, Max. Finished board size: 23*25(580*900mm)
5, Min. Drilled hole size: 3mil(0.075mm)
6, Min. Line width: 3mil(0.075mm)
Min. Line spacing: 3mil(0.075mm)
7, Surface finish/treatment: HASL/HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating.
8, Copper thickness: 0.5-7.0 oz
9, Solder mask color: Green/yellow/black/white/red/blue
10, Copper thickness in hole: >25.0 um(>1mil)
11, Inner packing: Vacuum packing/Plastic bag
Outer packing: Standard carton packing
12, Shape tolerance: ± 0.13
Hole tolerance: PTH: ± 0.076 NPTH: ± 0.05
13, Special requirements: Buried and blind vias+Controlled impedance+BGA
14, Profilling: Punching. Routing. V-CUT. Beveling
15, Provides OEM Services to all sorts of printed circuit board assembly as we as electronic encased products.
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