Mobilephone Upper/Lower Cover

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Mobilephone Upper/Lower Cover
Posting date : Dec 01, 2011
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39-
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Detailed Description
Product Name: Mobilephone upper/lower cover Mold Steel: S136H / 8407 / 718H Mold Base: LKM Mold Components: HASCO, DME, PUNCH, JINHONG,etc.(For Reference) Main Softwares: Autocad, UG, Pro/E, Catia, Solidworks, etc. After-sales Services: Experienced engineers will provide all-round technical solutions to any problems occurred in customers' mold operation. Features: High efficiency, short delivery time, competitive price.

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
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